MEI’s FluidJet™ Metal Lift-off System and Advanced Etch Solutions at 2014CS MANTECH

Company’s patented process achieves superior metal lift-off performance
reducing damage, chemical consumption, and increasing reclaim

 

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ALBANY, Ore. and CS MANTECH 2014—DENVER—May 19, 2014—

BOOTH #7—MEI Wet Processing Systems and Services LLC (MEI), is introducing its world-class metal lift-off and advanced etch systems at CS MANTECH this week in Denver. MEI will be sharing its advanced process technologies for the company’s semiconductor wet benches, with specific applications for compound semiconductor wet processing, including metal-lift off, silicon etch, metal etch (including gold etch), InGaP, and GaAs etch.

CS MANTECH is a forum for the compound semiconductor community to exchange and discuss new ideas and facilitate cooperation between industry, suppliers, and academia.

MEI, LLC has made a significant process breakthrough to enable higher yielding, more cost-effective metal lift-off processing—ideal for manufacturing compound semiconductors and MEMs devices.

Learn more about FluidJet Processing