Inception Single Wafer Processing Tool

Clean, Etch, Strip & Dry - Enabling the Transition from R&D to Pilot Production

FEATURES:

• Provides process consistency to develop your POR
• FEoL (Acid) & BEoL (Solvent) processing applications
• Automated Wafer Handling (Manual Load Optional)
• Wafers up to 200mm and masks up to 7 x 7
• Dual moving spray arms with separate chem lines
• Stationary bottom spray nozzles for DI and N2
• Etch uniformity exceeds batch systems
• Stationary bottom spray nozzles for DI and N2
• Standard dual tank design provides multi-step processing
  (4-tank optional)
• Manual or automated wafer handling
• Single or dual load ports
• Low utility consumption
• Small Footprint Dimensions - 36"w x 83"h x 76"l
• Highly flexible software enables rapid process development

NO CONTAMINATION

• Particle neutral
• Ionic contamination less than < 1E10

ETCH STABILITY CONCENTRATION CONTROL

• Hyper accurate concentration controls (ABB, Horiba, CI Semi)
• Hyper accurate spiking capability (Chemical & DI)
• Automatic compensation for losses due to consumption and evaporation

SUPERIOR ETCH UNIFORMITY

• 75mm–200mm EPI Materials
• Wafer to wafer < = 1%
• Within wafer < = 1%
• Lot to lot < = 1%

Superior Process Control

• Data logging by Lot ID
• Flexview APC monitoring
• SECS/GEM compliant host
• Unlimited user/permission levels
• Easy-to-use, touch-screen interface
• Error logging and data graphing
• Unlimited recipes, speeds, chem control
• Barcode reader compatibility
• Remote access compatible

PROVEN RELIABILITY

• MTBF > 1500 hr (Semi E10-94)
• Avg MTTR < 1 hr
• Higher uptime > 97%
• Reduced scrap

CONTROL

Analog sensing enables software to control: In-tank blending

• Precision ratio creation
• Precision DI water inject
• Tight temperature control
• Closed loop recirculation flow
• Hyper accurate chemical spiking controls